What are the core advantages of FPGAs in video encoding and decoding compared to ASIC or pure GPU solutions?

The core advantages of FPGAs lie in their extremely low deterministic latency and high flexibility in interfaces and algorithms. In scenarios such as railway train control or military image transmission, FPGAs can achieve microsecond-level custom video stitching, format conversion, and encryption, while supporting flexible configuration of multiple SDI/HDMI interfaces—capabilities that fixed-function ASICs or general-purpose GPUs struggle to match.

How does Qiyun Zhixun ensure signal integrity for high-speed video processing boards?

We adopt a full-process SI/PI simulation-driven design. From pin assignment optimization during the schematic stage, to 3D electromagnetic field simulation and via return path analysis during PCB layout, and finally to TDR impedance testing and eye diagram verification after board manufacturing, we ensure the signal quality of 12G-SDI and high-speed backplane buses in complex electromagnetic environments.

What industry scenarios are suitable for the RK3588-based heterogeneous video processing platform?

This platform is suitable for scenarios with strict requirements for domestic substitution rates, edge computing power, and multi-channel video concurrency, such as on-board AI video analysis for railway train control, multi-spectral image fusion streaming for military drones, and format conversion with SRT low-latency streaming for broadcast-grade mobile live streaming backpacks.

What are the key PCB design control points for 12G-SDI and 4K video interfaces?

12G-SDI runs at 11.88 Gbps with a Nyquist frequency close to 6 GHz, so impedance must be held at 100 Ω ±10% differential (75 Ω ±5% single-ended), traces kept short with minimal via layer changes; 4K HDMI 2.0 TMDS pairs require intra-pair skew within ±5 mil, continuous reference planes and AC-coupling capacitors placed close to the connector. Our video boards are verified for impedance and workmanship to IPC-6012 Class 3, holding volume yield above 99%.

How long does a custom FPGA video encoding board take, and what drives the cost?

A typical project runs 6-10 weeks from requirement freeze to prototype: 3-4 weeks for schematic and PCB layout, 2-3 weeks for PCB fabrication and SMT assembly, 1-3 weeks for hardware/software bring-up. Cost is driven mainly by the FPGA part (an XC7K325T versus a Zynq UltraScale+ device can differ several-fold), layer count (8-16 layers) and high-speed connectors; small pilot runs also carry one-off stencil and test-fixture charges. We support one-stop delivery from bare board design to complete unit, and can quote after a feasibility review.

Evolution of FPGA Video Encoding Chips and Embedded Hardware Analysis

Source: North News "2026 New Generation HEVC Codec Chip Release Drives Xingkong Sports (Official) Ultra-HD Transformation"
Original Link: https://www.northnews.cn/wiki/story/bIxMIlzkkbIT.htm

Introduction: The Hardware Cornerstone Behind Ultra-HD Broadcasting

In June 2026, semiconductor manufacturer Xilinx announced the launch of the new-generation HEVC codec chip, the XC7VX550T. Based on a 7nm process, this chip integrates dual AV1 and HEVC encoders along with an AI image quality enhancement engine, achieving real-time 4Kp60 encoding and ultra-low latency of 120ms under a single-module power consumption of 25W. As a technical team deeply engaged in PCB design, FPGA development, and embedded system integration, Xi'an Qiyun Zhixun Electronic Technology Co., Ltd. (hereinafter referred to as "Qiyun Zhixun") believes that the release of this chip is not only a milestone in the field of video processing but also provides a crucial technological weathervane for high-speed embedded hardware design, signal integrity analysis, and heterogeneous computing platform development.

I. Technological Breakthroughs in the New-Generation FPGA Video Processing Architecture

The core advantages of the XC7VX550T lie in its high integration and AI empowerment. Compared to traditional pure software or single-ASIC solutions, this chip supports the simultaneous encoding of 16 independent streams and the output of a single TS stream through a hardware-level, frame-level precise synchronization interface. In Qiyun Zhixun's FPGA development practice, we are well aware of the stringent requirements that concurrent processing of multiple high-definition video streams places on logic resource scheduling and memory bandwidth.

The built-in lightweight neural network module in this chip can perform noise reduction and sharpening before encoding, extending the dynamic range by 2 stops. This heterogeneous architecture of "traditional encoding + AI enhancement" is precisely the mainstream evolutionary direction for current high-end video processors. For military or industrial customers requiring custom video processing algorithms, FPGA-based video processing platforms can provide extremely high flexibility. By rapidly iterating AI inference and image enhancement IP cores through RTL-level code or High-Level Synthesis (HLS), they can meet the needs for non-standard video format conversion in specific scenarios.

II. Challenges of High-Speed Interfaces to PCB Signal Integrity (SI)

Reports indicate that the XC7VX550T is compatible with MPEG-TS and SRT transmission protocols and supports SDI over IP bridging. In Qiyun Zhixun's high-speed PCB design business, when handling 12G-SDI or 100GbE Ethernet interfaces, Signal Integrity (SI) and Power Integrity (PI) are critical to determining system stability.

Impedance Control and Crosstalk Analysis: The 12G-SDI signal rate is extremely high. PCB traces require strict control of differential impedance (typically 100Ω), and via models must be optimized using 3D electromagnetic field simulation tools to reduce reflection and crosstalk. We typically employ a stackup design of 10-layer or more High-Density Interconnect (HDI) boards to ensure the integrity of the return path for high-speed signals.
Power Integrity Design: The core voltage of 7nm process FPGAs is extremely low, and current transients are massive. A multi-layer power plane design must be adopted, coupled with a high-frequency decoupling capacitor network, to ensure that the PDN (Power Distribution Network) impedance meets target requirements across a wide frequency band, preventing voltage droops from causing encoder logic errors.
Thermal Design and Layout: The full-load power consumption of 25W per module creates immense thermal dissipation pressure in enclosed spaces such as mobile backpacks or drones. PCB layout must be combined with thermal simulation to optimize copper pour thermal dissipation paths, and external thermal interface materials must be used to ensure junction temperatures remain within safe limits.

III. Heterogeneous Computing and Domestic Embedded Video Platforms

Although Xilinx provides a powerful single-chip solution, in many scenarios involving domestic substitution and edge computing, the heterogeneous architecture of "SoC + FPGA" or "High-Performance ARM + NPU" offers better cost-effectiveness. Qiyun Zhixun has accumulated extensive experience in video format conversion and streaming encoding during the development of embedded boards based on the RK3588.

The RK3588 features built-in NPUs and VPUs for 8K decoding and 4K encoding. Combined with an FPGA co-processing daughter board designed by Qiyun Zhixun, it can achieve front-end multi-channel SDI/HDMI acquisition, low-latency video stitching and format conversion within the FPGA, and then transmit the processed data to the RK3588 via a PCIe 3.0 x4 interface (with a bandwidth of up to 32Gbps) for H.265/AV1 encoding and SRT streaming. This architecture not only ensures ultra-low latency in front-end processing but also leverages the robust ecosystem and encoding capabilities of the domestic SoC, making it widely used in railway train control on-board video recording and military field image transmission systems.

IV. Hardware Reliability Design for Extreme Environments

The report mentions that mobile encoders equipped with this chip achieved 8 continuous hours of operation without overheating or thermal throttling in extreme scenarios such as outdoors at minus 10 degrees Celsius and during marathons. This confirms the stringent reliability requirements for industrial-grade and military-grade embedded systems.

In the design of railway train control and military embedded boards, Qiyun Zhixun strictly adheres to standards for wide temperature ranges, shock resistance, and salt spray prevention. For video processing equipment, we use high-Tg (Glass Transition Temperature) board materials and conformal coating processes, and add optocoupler isolation and TVS surge protection at the interfaces. This ensures that the equipment complies with the GJB150A military standard and the EN50155 railway on-board equipment standard, maintaining long-term stable operation under strong electromagnetic interference and harsh climatic conditions.